860 is a CPU heat sink compound thermal paste designed to reduce thermal resistance between irregular metal surfaces. Coupled with reasonable thermal conductivity, 860 has a soft consistency and a wide operating temperature range, which in some instances makes it the best thermal paste for CPU applications.
This silicone-based PC thermal paste is primarily used to enhance heat transfer between heat sinks and heat-generating components, such as CPUs, GPUs, LEDs, motors, and power components.
Features & Benefits
